General Micro Systems announced the launch of its X9 Spider family of distributed, ruggedized computing modules to support the demanding needs of next-generation warfare. Through its innovative inter-locking mechanical design, MOSA Thunderbolt interfaces, OpenVPX cross-platform compatibility, and patented LightBolt connectors, the X9 Spider family empowers designers to decentralize, distribute, and rapidly upgrade computing, networking, storage, artificial intelligence (AI), and video resources wherever and however the program demands.
Built for limitless expandability, the X9 Spider family is based on brand-new, patent-pending mechanical features that allow devices to stack and connect together electrically, physically, and thermally but at light speed (literally) with minimal signal bottlenecks. As well, X9 Spider connects directly to next-gen sensors without intermediate electronics—simplifying their connection to the electronic system—making the sensors themselves equally scalable and modular. This kind of upgradeability gives the DoD, primes, and system developers limitless possibilities with very low upgrade costs.
No one in the rugged industry has anything like X9 Spider because much of the technology was invented and patented by GMS. The revolutionary family includes: Interconnectivity via the COTS open standard Thunderbolt 4 technology, developed by Intel and Apple. As well, 100Gb Ethernet over fiber connects X9 Spider modules to each other and to other high-speed systems; Two “Host” modules with a range of storage and network capabilities powered either by Intel’s latest 11th-generation Xeon W (Tiger Lake-H) 8-core CPU, or by NVIDIA’s Jetson AGX Orin GPGPU with ARMcore engine, plus GPGPU CUDA and Tensor cores; Six (6) companion X9 modules including: “Workstation” with removable storage and up to 14 sites for add-in I/O like MIL-STD-1553; Network “Switch” with four 100Gb and eight 10Gb Ethernet ports; “Storage” with removable canister and up to eight high-density M.2 or U.2 SSD storage devices; “GPGPU” with NVIDIA RTX-5000 GPGPU and custom I/O module such as video frame grabber for autonomous driver sensors; and utility X9 Spider modules for “Power” and “Cooler”; Improved reliability and robustness through the patent-pending QuadroLock active wedge lock technology, enabling X9 Spider modules to interlock to withstand severe noise, vibration, and harshness while simultaneously transferring heat between modules for maximum cooling; Cutting-edge, long-range, and cost-efficient interconnects through the patent-pending LightBolt connector, supporting Thunderbolt 4 fiber or copper and 100W power in one cable;
The Achilles heel of a traditional ATR-style box using VME or OpenVPX cards is the lack of flexibility. The box can’t be opened or modified without a requalification; changing the cards requires I/O and backplane rewiring; upgrades can only be done using the box’s same card style (as opposed to choosing the market’s best technology choice), and the box is an expensive single point of failure. As well, with all functions centralized in one box, the whole system’s electrical power and heat are concentrated in one location.
The GMS X9 architecture includes 22 patents either filed for or granted.
The X9 Spider-based computing modules will be available in different variations to meet the unique needs of each application. The first module is the “X9 Spider Wearable”, also announced this week at AUSA2022. GMS will introduce other X9 Spider family products by the end of the year.
